The thermal cantilevers are the core of the NanoFrazor, with their technology originating from the IBM Millipede project. The probes feature a heatable tip, a fast and precise electrostatic actuation mechanism allowing for 3D patterning, and an integrated topography sensor for in-situ metrology. Currently we provide High Power Cantilevers for use in the NanoFrazor Explore. Additional cantilever designs are in development in collaboration with several partners. They will enable patterning on non-conductive substrates and enhance performance through the use of tip arrays.

High Power Cantilever

  • Based on IBM Millipede technology
  • Ultra-sharp silicon tips
  • Two integrated micro-heaters (topography sensor & tip heater)
  • Topography sensor to measure the distance to the surface with sub-nm resolution via the heat exchange through the air
  • Fast and accurate electrostatic actuation via the workpiece
  • Fabrication on full wafers keeps the costs per cantilever low
  • Easy manual cantilever exchange without additional tools

Backside Electrode Cantilever

  • Same material as High Power Cantilever
  • Enables patterning on electrically isolating substrates
  • No contacting of workpiece needed

Thermal Cantilever Characteristics

Tip radius < 7 nm
Tip height 700 nm
Spring constant 0.25 N/m
Resonance frequency 100 kHz
Microheaters size 4 µm x 2 µm x 0.4 µm
Microheaters temperature range 20° - 1000 °C
Microheaters thermal time constant 6 µs
Topography sensor resolution 0.1 nm
Topography sensor bandwidth 150 kHz
Exchange and calibration of cantilevers < 1 minute