The thermal cantilevers are the core of the NanoFrazor, with their technology originating from the IBM Millipede project. The probes feature a heatable tip, a fast and precise electrostatic actuation mechanism allowing for 3D patterning, and an integrated topography sensor for in-situ metrology. Currently we provide High Power Cantilevers for use in the NanoFrazor Explore. Additional cantilever designs are in development in collaboration with several partners. They will enable patterning on non-conductive substrates and enhance performance through the use of tip arrays.

  • Based on IBM Millipede technology
  • Ultra-sharp silicon tips
  • Two integrated micro-heaters (topography sensor & tip heater)
  • Topography sensor to measure the distance to the surface with sub-nm resolution via the heat exchange through the air
  • Fast and accurate electrostatic actuation via the workpiece
  • Fabrication on full wafers keeps the costs per cantilever low
  • Easy manual cantilever exchange without additional tools
  • Same material as High Power Cantilever
  • Enables patterning on electrically isolating substrates
  • No contacting of workpiece needed
Thermal Cantilever CharacteristicsValue
Tip radius< 7 nm
Tip height 700 nm
Spring constant0.25 N/m
Resonance frequency100 kHz
Microheaters size4 µm x 2 µm x 0.4 µm
Microheaters temperature range20° - 1000 °C
Microheaters thermal time constant6 µs
Topography sensor resolution0.1 nm
Topography sensor bandwidth150 kHz
Exchange and calibration of cantilevers< 1 minute